Chris Schaffer focuses his practice on patent prosecution, technology licensing and counseling with an emphasis in the areas of telecommunications, power electronics, semiconductor processing, electronics packaging, advanced materials, thermal management and mechanics.
Prior to joining the firm, Mr. Schaffer was a practicing scientist who obtained 10 patents, authored numerous technical articles and served on the technical committee for several conferences.
From 2005 to 2012, Mr. Schaffer was the Director of Engineering at Pulse Electronics in San Diego where he led a worldwide engineering team in the research and development of LAN (Local Area Network) and Telecommunications components for the electronics industry. Products consisted of Ethernet transformers, RF filters, high-speed connectors and central office splitters.
From 2000 to 2005, Mr. Schaffer was a Design Center Manager at International Rectifier in Los Angeles where he led a multi-disciplinary engineering team in the development of advanced multi-chip power conversion modules for consumer, telecom and industrial applications. The modules included customized state-of-the-art MOSFETs, ASICs and integrated passives.
From 1993 to 2000, Mr. Schaffer was a Research Engineer at Boeing where he led the research and development of advanced materials such as chemically vapor deposited diamond and carbon-carbon composites for use in spacecraft electronics. He also designed and tested RF electronics subassemblies for military spacecraft programs.
University of San Diego School of Law, J.D.
California State University, M.S., Mechanical Engineering (2002)
University of Southern California, M.S., Materials Science (2001) Hughes Fellowship Recipient
School of Mines and Technology, B.S., Mechanical Engineering (1994)
United States Patent and Trademark Office (2008)
Virginia Tech Center for Power Electronics Systems Steering Committee, Technical Director (2004)
National Technical Committee for 1998 International Conference on MCM’s and High Density Packaging (IEEE, IMAPS, CPMT), Member
Thermal Management Session, 1998 International Conference on MCM’s and High Density Packaging (IEEE, IMAPS, CPMT), ChairmanThermal Management Session, 1997 ISHM Advanced Packaging Technology Workshop, Chairman
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